Industry Solutions

Semiconductor Manufacturing

Sub-micron precision surface solutions for wafer carriers, lead finishing, and optical components in semiconductor manufacturing — cleanroom-compatible materials with particle control.

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Challenge & Solution

Industrial Challenges & Precision Solutions

CHALLENGES

SOLUTIONS

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Sub-micron particle control requirements on wafer carrier and jig surfaces

✓

Low-particle-generation consumables designed for cleanroom semiconductor environments

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Lead finishing for IC packages without introducing contamination

✓

MSD600 closed-loop automation minimizes contamination risk during lead processing

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Ultra-smooth optical element polishing for lithography and inspection equipment

✓

SC Series P2000–P5000+ achieves Ra ≤0.1μm for optical-grade surfaces

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High-mix production with frequent product changeovers in fab environments

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5-stage color-coded system ensures consistent Ra ≤0.1μm across product changeovers

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Supply security for long-term semiconductor manufacturing programs

✓

Multi-tier supplier strategy with cleanroom-compatible backup sources

Surface Finishing Process

Standardized Surface Finishing Roadmap

From carrier prep to cleanroom polish — A color-coded, repeatable process for semiconductor manufacturing.

P2000

Stage 1: Carrier Surface Prep

Fine surface refinement on wafer carrier and jig surfaces

SC Series

P3000

Stage 2: Surface Equalization

Ultra-fine material removal approaching optical surface quality

SC Series

P5000+

Stage 3: Optical Pre-polish

Scratch elimination for lithography-grade surface preparation

SC Series

✦

Stage 4: Lead Finish Prep

Pre-polish preparation for IC lead finishing

SC Series

✦

Stage 5: Cleanroom Polish & Marking

Ra ≤0.1μm finish + low-outgassing functional marking inks

PolishingInks

Performance Metrics

Verified Performance Benchmarks

Quantified outcomes independently validated against industry standards

Ra ≤0.1μm

Surface Finish Capability

Optical element quality surface

≤1μm

Particle Control Target

Sub-micron contamination limit

Cleanroom

Environment Compatibility

Cleanroom-compatible consumables

P5000+

Fine Grit Availability

Ultra-fine grit for optical surfaces

Recommended Product Matrix

Each product is selected based on process fit, material compatibility, and end-use performance requirements.

🧽 Core Product

SC Series (Fine Grit)

Ultra-fine grit abrasives (P2000–P5000+) for sub-micron semiconductor surface quality.

Application: Wafer Carriers & Optical Elements

Grit Range

P2000–P5000+

Surface

Ra ≤0.1μm

Particles

Low-generation

Application

Carriers

View Product ▹ Includes datasheet

✨ Process Solution

Polishing Systems

5-stage color-coded polishing system for Ra ≤0.1μm consistency on microelectronic components.

Application: Optical Elements & Lead Frames

Surface

Ra ≤0.1μm

Stages

5-stage

Consistency

Batch-to-batch

Application

Optics

View Product ▹ Includes datasheet

🖌️ Surface Protection

Functional Inks

Low-outgassing functional marking inks for semiconductor device identification and protective coatings.

Application: Device Marking & Protective Coating

Outgassing

Low

Adhesion

5B rating

Application

Marking

Application

Protect

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Precision for Next-Gen Chip Packaging

Our semiconductor application specialists will review your surface requirements and provide cleanroom-compatible technical solutions — typically within 24 business hours.

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